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《网站你懂我意思正能量免费下载安装-网站你懂我意思正能量免费...》视频说明：方源又想起之前他和荒兽泥怪的战斗首发2024-07-27 07:22·体坛丰运SMT常见名词中英文对照大全2021-01-18 00:00·Arvin1562AAccuracy 精度ACC:accepted 接受ACF Anisotropic Conductive Film 异方性导电胶膜制程Additive process 加成工艺Administration/General Affairs Dept 总务部ADSL 即为非对称数字用户回路调制解调器Adhesion 附着力Aerosol 气溶剂AI :Auto-Insertion 自动插件Angle of attack 迎角Annular ring 环状圈Anisotropic adhesive 各异向性胶AOI:automatic optical inspection.自动光学检查Applicability 实用性APQP:Advanced product quality planning 先期产物质量策划AQL :acceptable quality level 允收水准Array 列阵Artwork 布线图Assembly 组件ASIC:application specific integrated circuit 特殊应用集成电路ATE :automatic test equipment 自动测试ATM :atmosphere 气压AVL：acceptable vendor list 允许的供应商清单/允收单BBattery Electro Welder 电池电极焊接机Bare chip 裸芯片barcode 条码Bent 弯形BGA :ball grid array 球形矩阵BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Billboard 侧立Blind via 盲孔Blowholes 气孔BOM:bill of materiel 物料清单Bond lift-off 焊接升离Bonding agent 粘合剂Briding 桥接(短路).Buried via 埋孔bulk feeder 散装式供料器buffer loader 收板机CCapacitor Life Test with Leakage Current 电容漏电流寿命测试机CAR：corrective action request 纠正行动通知cause and effect matrix（fish bone diagrams）因果图（鱼骨图）CAD/CAM system 计算机辅助设计与制造系统Capillary action 毛细管作用cBGA：ceramic BGA陶瓷球型矩阵CCD :charge coupled device 监视连接组件(摄影机)Chip on board COB板面芯片Chip Terminator 积层组件端银机Chip 片状元件Chamber system 炉膛系统check 确认check sheet（list）调查表Circuit tester 电路测试机Cladding 覆盖层CLCC :Ceramic leadless chip carrier 陶瓷引脚载具cleaning solvent 清洁剂cleaning paper 擦拭纸CMP(化学机械研磨)制程COB :chip-on-board 芯片直接贴附在电路板上Components Vision Inspection System芯片组件外观检查机Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数字相机Convection reflow soldering 热对流再流焊Component 元件Cold solder joint 冷焊锡点Component density 元件密度Copper foil 铜箔Copper mirror test 铜镜测试Copper clad laminates 覆铜箔层压板Component check 元件检查Component transport 元件传送Component pick-up 元件拾取Cold cleaning 冷清洗Cold solder 冷焊Conductive epoxy 导电性环氧树脂Conductive ink 导电墨水Conformal coating 共形图层control cards （chart）控制图Corrupted 腐蚀cost management Dept 经管component feeder 元件进料器complete 完成CPI：continuous process improvement持续过程改进CPK:indexes of process capability 修正工序能力指数cps :centipoises(黏度单位) 百分之一CS:customer service 客户服务CSB :chip scale ball grid array 芯片尺寸BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数Cursting 发生皮层Cure 烘烤固化Cycle rate 循环速率Ddaul wave soldering 双波峰焊Damage 破损Dataplay Disk 微光盘Date recorder 数据记录器DAS:defects analysis system 缺陷分析系统DCC：document control center文控中心D/C:date code 生产日期DC:detection control 探测控制DC:document center 资料中心defective material 物料不良Depaneling Machine 组装电路板切割机Device 器件Defect 缺陷defect solder 少锡Dewetting 缩锡Delamination 分层Desoldering 卸焊Deviation 偏移design center 设计中心Delivery control center 交管detection 探测度DFM:design for manufacturing 面向制造的设计DFA: design for assembly 面向装配的设计DFSS:design for six sigma 六西格玛设计Dispersant 分散剂DIP :dual in-line package 双内线包装(泛指手插组件)DOE Design Of Experiment （实验计划法）Downtime 停机时间Documentation 文件编制Dourometer 硬度计DPSS Lasers 半导体激发固态雷射Dpm：defects per million 百万缺陷率DRG：drawing 图纸Dull joint 焊点发灰EECO:engineering change order 工程变更需求E（D）CN：engineering（design） changer notice 工程（设计）变更通知EE:electronics engineering 电子工程师EMS 专业电子制造服务ENTEK 裸铜板上涂一层化学药剂使PCB的pad比较不会生锈Environmental test 环境测试ESD:electrostatic discharge 静电防护Eutectic solders 共晶焊锡Excessive solder 多锡Excessive parts 多件Excessive paste 吸量多Excess flux 助焊剂过多Excess glue 多胶FFA:failure analysis 不合格品分析FC:failure cause 失效起因FCT:functional test 功能测试FE:failure effect 失效影响Feeder holder 供料架feeder供料器Fiducial 基准点Fillet 焊角Fixture 夹具FIFO:first in first out 先进先出Flex Circuit Connections 软性排线焊接机Flip chip 覆晶FLUX 助焊剂FLUX SIR 加湿绝缘阻抗值Flux bubbles 焊剂气泡Flip Chip 覆晶接合Floating虚焊Flexibility 柔性Flexible stencil 柔性金属网板Flying 飞片FMEA：failure mode and effects analysis 失效模式及影响分析F.M. 光学点FM:failure mode 失效模式F.O.R：fault output rate 不良比率FPT :fine pitch technology 微间距技术FPY：first pass tield 直通率FPC:flexible printed circuit board 挠性印制电路板/软板FQA：final quality assyuance 最终品质保证FQC：final quality control 最终品质控制FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)GGeneral placement equipment 中速贴片机Golden boy 金样Green Strength 未固化强度(红胶)Green Tape Caster, Coater 薄带成型机Green Tape Cutter 元件切割机GR&R:gauge reproductiveness repeatability 重复性与再现性HHalides 卤化物Hard water 硬水Hardener 硬化剂hand solder 烙铁HDI board ：High Density Interconnector 高密度连接板histogram直方图High Voltage Burn-In Life Tester 高压恒温恒湿寿命测试机High speed placement equipment 高速贴装机Hot air reflow soldering 热风再流焊IIA Information Appliance 信息家电产物IATF:international automotive task force 国际汽车行动小组IC :integrate circuit 集成电路ICT:in circuit test 在线测试IE：industrial engineering 工业工程学IMC:inter metallic compound 金属间化合物Insufficient paste 锡量少Insufficient glue 胶量不足insufficient solder 少锡Insufficient solder 虚焊Ion lasers离子镭射IPQC：in process quality control 过程品质控制IQC：incoming quality control 来料品质控制IR :infra-red 红外线ISO:international standard organization 国际标准化组织ISP (Internet Service Provider) 指的是网际网络服务提供JJIS 日本工业标准JIT:just in time 刚好准时KKpa :kilopascals(压力单位)KPI：key performance index 主要绩效指标LLAB:laboratory 实验室Laser reflow soldering 激光回流焊Laser Diode 半导体镭射LCCC : Leadless Ceramic Chip Carrier 无引线陶瓷封装载体LCD Rework Station 液晶显示器修护机Lead cut long 管脚长Lead cut short 管脚短Lead out 管脚漏出Lead configuration 引脚外形LGA (Land Grid Arry)封装技术 LGA封装不需植球适合轻薄短小产物应用line certification 生产线确认Low temperature paste 低温锡膏Low speed placement equipment 低速贴片机Located soldering 局部软钎焊Ion Lasers 离子镭射LOT:批量logistical Dept 物流部LQC：line quality control 生产线品质控制L/T:lot number 批次LSL：lower specification limit 规格规范下限Mmark 标记MAJ：major 严重Manufacturers Association 表面贴装设备制造协会Machine vision 机器视觉material control Dept 物管MC:material control 物料控制MCM :multi-chip module 多层芯片模块MD: manufacturing Dept 制造部ME:manufacture engineering 制造工程MELF :metal electrode face 二极管Melf 圆柱形元件MESH 网目Metal stencil 金属网板MFG:manufacturing 制造单位Misalignment 偏斜Missing 少件/缺件MIN：minor 轻微MLCC Tester 积层电容测试机MLCC Equipment 积层组件生产设备Movement 位移Modularity 模块化MO: manufacture order 生产单MQFP :metalized QFP 金属四方扁平封装MRP:material requirement planning 物料需求计划M.S.D.S 国际物质安全资料MSA:measurement system analysis 测量系统分析MTBF:Mean time between failure 平均故障间隔时间NN/A：not applicable 不适用Nd: YAG Laser 石榴石雷射NEPCON :National Electronic Package and Production Conference 国际电子包装及生产会议NG:No good 不好/错误NONCFC 无氟氯碳化合物No solder 空焊Non-dewetting 不沾锡Nonwetting 不润湿No-clean solder paste 免清洗锡膏Nought materiel 无料nozzle 吸嘴nozzle information 吸嘴信息OOA:organic activated 有机活性的occurrence 频度OEM:original equipment manufacturer 原始设备制造商OEE:overall equipment efficiency 所有设备效率Optic correction system 光学校准系统ORT 持续性寿命测试OS:operation system 作业系统Overturned 翻转Overflow solder 溢锡OXIDE 氧化物PPAD焊垫/焊盘PAL：pallet/skid 栈板Parts missing. 缺件Parts damaged 零件破损Packaging density 装配密度Past mask 网板层/助焊层Paste working life 焊膏工作寿命Paste shelf life 锡膏储存寿命Pass 通过PBGA:plastic ball grid array 塑料球形矩阵PCB:printed circuit board 印刷电路板PCBA: printed circuit board assembly 印制电路板组件PCMCIA Card Welder PCMCIA卡连接器焊接PCB damaged PCB损伤PCC:product control center 生产控制中心P-chart 不良率控制图PCN:process change notice 工程改变通知PC:prevention control 预防控制PCS:pieces 个PDA (个人数字助理器)PDCS:process defect control sheet 制程异常联络单PD:product department 生产部personnel Dept 人事部PE:products engineering 产物工程师Peeling 剥落PFC :polymer flip chip PLCC:plastic leadless chip carrier 塑料式有引脚芯片承载器photoploter 相片绘图仪Placement equipment 贴装设备PLCC:plastic leaded chip carrier 塑型有引脚芯片载体Placement accuracy 贴装精度Placement pressure 贴装压力Placement speed 贴装速度Placement procedure 元件放置planning Dept 企划部PMT 产物成熟度测试PMC:production &material control 生产和物料控制PMP:product management plan 生产管制计划P/N:part number 料号Polyurethane 聚亚胺酯(刮刀材质)Poor tack retention 粘着力不足PO:purchasing order 采购订单POP:Package on Package 元件堆叠装配POP：packing operation procedure 包装操作规范PP：process capability 工程性能指数ppm：part per million 百万分之一PPAP: Production part approval process 生产件批准程序PPID:product part identification 产物料号识别码Precise placement equipment 精密贴装机Production conference 生产会议process flow chart 流程图PRS:pairs 双psi :pounds/inch2 磅/英寸2.PTH :Plated Thru Hole 导通孔Puddle Effect 水沟效应 早期大面积松宽线路之蚀刻银贯孔(STH)铜贯孔(CTH)purchashing Dept 采购部PWB :printed wiring board 电路板QQA：quality assurance 品质保证QC：quality control 品质控制QCC:quality control circle 品质圈QE：quality engineering 品质工程QFP :quad flat package 四边平坦封装QIT:quality improve team 品质改进小组QTY:quantity 数量quality Assurances Dept 品保部RR&D:research&design 设计开发部Reflow soldering 回流焊接Rework 返工Repair 返修Repeatability 重复性REJ:rejected 拒收Rheology 流变学Resolution 分辨率Reversed/inverted 反向RMA:return material authorization 维修作业意指产物售出后经由客户反应发生问题的不良品维修及分析Rotating deviation 旋转偏差SSCM：supply chain management 供应链Screen Printing 刮刀式印刷Screen printing 刮刀式印刷Schematic 原理图Screen printing plate 网板semi-aqueous cleaning 不完全水清洗SEM:scan election microscope 扫描电子显微镜Self alignment 自定位Sequential placement 顺序贴装severity 严重度Shifting deviation 平移偏差Shadowing 阴影Short circuit 短路Shift 偏移Silk screen 丝印面Silver Electrode Coating Machine 电阻银电极沾附机SIR :surface insulation resistance 绝缘阻抗Silver chromate test 铬酸银测试Slurry 研磨液Slump 坍塌Smearing 模糊SMC :Surface Mount Component 表面黏着组件SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount Equipment Manufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术S/N: serial number 序列号Solder pad off 焊盘脱落SOIC :small outline integrated circuit SOJ :small out-line j-leaded package SOP :small out-line package 小外型封装SOT :small outline transistor 晶体管Solder Recovery System 锡料回收再使用系统Solder mask 防焊漆/阻焊层Soldering Iron 烙铁Solder paste 焊锡膏Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊Solderability 焊锡性Solder Wires 焊锡线Solder Bars 锡棒SOP Standard Operation Procedure 标准作业规范Solder 锡尖Solder bridge 桥连Solids 固体Solidus 固相线Solder Powder 锡颗粒SPC :statistical process control 统计过程控制SPS 交换式电源供应器SPEC:specification 规格special characteristic 特殊特性Squeegee 刮刀squeegee刮刀SQC:statistical quality control 统计品质管制SSOP :shrink small outline package 收缩型小外形封装Stencils 钢板/网板STN-LCD(中小尺寸超扭转向液晶显示器 行动电话用Stencil printing 网板印刷Stain 污点Stick feeder 杆式供料器Storage life 储存寿命Surface Mounting Equipment 元件表面黏着设备Support pin 支撑柱Subtractive process 负过程Surfactant表面活性剂switch 开关SWR：special work request 特殊工作需求Syringe 注射器TTAB :tape automaticed bonding 带状自动结合Tape Automated Bonding, TAB 卷带式自动接合Taping Machine 芯片打带包装机Tape and reel 带和盘Tape feeder 带式供料器TCE :thermal coefficient of expansion 膨胀(因热)系数TCP (Tape Carrier Package) 带式载体封装TE:test engineering 测试工程师Tear/torn 撕裂TFT-LCD：Liquid-Crystal Displays Addressed by Thin-Film Transistors 薄膜晶体管液晶显示器Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔)Through hole 贯穿孔THT:through hole technology 通孔安装技术Through via 通孔Thermocouple 热电偶Touch up 补焊Tomb stone 立碑TPM:total production maintenance 全面生产保养TQFP :tape quad flat package 带状四方平坦封装Transter Pressure 转印压力(印刷)Tray feeder 盘式供料器UuBGA :micro BGA 微小球型矩阵Ultrafast Laser System 超快镭射系统Unclear mark 标示不清Uncleaning 脏污Uneven/unflush 不平齐Unsolder/open solder 开焊UV :ultraviolet 紫外线USL:upper specification limit 规格规范上限VVapor degreaser 汽相去油器Viscosity 黏度VPS:Vapor phase soldering 气相回流焊WWetteng ability 润湿能力Wire Bonding 打线接合Wire Welder 主机板补线机Wrong polarity 极性错误Wrong parts 错件W/S:wave solder 波峰焊XX-Ray Multi-layer Inspection System X-Ray 孔偏检查机YYield 产出率

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